The 11th Asia-Pacific International Symposium on Advanced Reliability and Maintenance Modeling

APARM2024 (The 11th Asia-Pacific International Conference on Advanced Reliability and Maintenance Modeling) is the biennial reliability conference in the Asia-Pacific region. Its purpose is to share advanced knowledge and information related to reliability and maintenance. Reliability and maintenance is the technology required in various fields such as power systems, communication networks, transportation, cloud computing, electronic systems, buildings and infrastructure, medical and healthcare, aviation and railway systems. It is also the foundation of a sustainable society. The goal of this conference is to bring together reliability researchers from the Asia-Pacific region to discuss and explore solutions to the various reliability challenges facing society.

Call for Papers

Paper Submissions

Submissions should be made through EasyChair (https://easychair.org/conferences/?conf=aparm2024). Manuscripts may be submitted in one of two categories: (i) Full Papers and (ii) Abstract Papers.

Full Papers: Word Format Download, LaTeX Format Download

At the same time as full paper submission, "Consent to Publish for Contributors to Books", "License to Publish for Contributors to Proceedings", and "Permission Verification Form" are required.

1. Consent to Publish for Contributors to Books
2. License to Publish_Proceedings
3. Permission Verification Form

Abstract Papers: Word Format Download, LaTeX Format Download, Sample Preview Download,

The goal of Abstract Papers is to report novel ideas and results that have not been fully evaluated. Submit original manuscripts (not published elsewhere) of no more than 4 pages in the original two-column format.

All papers submitted to the symposium will be peer-reviewed for merit and content. All papers accepted and registered for presentation at the symposium will be made available to symposium attendees on Cloud Drive during the symposium All accepted full papers will be published in the symposium proceedings by CRC Press.

Call for Special Sessions (Download)

Researchers and practitioners are invited to submit proposals for special sessions on focused topics. Such a theme can be either a research topic, an application area, or a mixture of the two. Examples of session topics include degradation models; health assessment of industrial batteries; wind farm maintenance management; high-speed rail applications; uncertainty modeling in construction management; etc.

A session proposal must include the following content

• - Session title
• - Session description of 100 to 150 words
• - Session organizers, affiliations, and e-mail addresses
• - Paper category for each paper submitted to the session (either full paper or abstract)
• - At least 4 names of invited speakers for the session and their tentative presentation titles.
• - The publishing schedule will follow the full/abstract paper schedule. Please submit your proposal in PDF or Word format to prog-aparm2024@ml.hiroshima-u.ac.jp (General Chairs of APARM2024).

Important Dates (Special Sessions)

• - March 15 March 29, 2024: Special Session Proposals Due
• - Paper submission dates will be determined by the session organizers.
• - Review and publication schedule will follow the full/abstract paper schedule.

Important Dates (Full Papers)

• - April 15, 2024 May 15, 2024 (extended): Paper submission due
• - April 28, 2024 May 30, 2024 (extended): Notification of acceptance
• - May 5, 2024 June 30, 2024 (extended): Camera-ready submission deadline
• - May 30, 2024: Early registration begins
• - June 30, 2024: Author registration deadline
• - July 31, 2024: Early registration ends
• - August 26-30, 2024: Conference

Important Dates (Abstract Papers)

• - April 15, 2024 May 15, 2024 (extended): Paper submission deadline
• - May 30, 2024: Acceptance notification and early registration begins
• - June 30, 2024: Camera-ready submission deadline and author registration deadline
• - July 31, 2024: Early registration ends
• - August 26-30, 2024: Conference

SPONSORS

• Aichi University
• SECOM Science and Technology Foundation
• Reliability Engineering Association of Japan